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| Ultra High-Precision Foil Wraparound Surface Mount Chip Resistor with Gold Plated Terminals for High Temperature Applications up to +250°C | Surface Mount | 0.01 | 2.5 | 225 | 10 | 125K |
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| Ultra High Precision Foil Wraparound Surface Mount Chip Resistor with Extended Pads for High Power/High Temperature Applications up to +225 °C, Load Life Stability of 0.05% ,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +225 | 10 | 25K |
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| Ultra High Precision Foil Wraparound Surface Mount Chip Resistor with Extended Pads for High Power/High Temperature Applications up to +225 °C, Load Life Stability of 0.05% ,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +225 | 10 | 30K |
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| Ultra High Precision Foil Wraparound Surface Mount Chip Resistor with Extended Pads for High Power/High Temperature Applications up to +225 °C, Load Life Stability of 0.05% ,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +225 | 10 | 70K |
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| Ultra High Precision Foil Wraparound Surface Mount Chip Resistor with Extended Pads for High Power/High Temperature Applications up to +225 °C, Load Life Stability of 0.05% ,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +225 | 10 | 125K |
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| Ultra High Precision Foil Wraparound Surface Mount Chip Resistor with Extended Pads for High Power/High Temperature Applications up to +225 °C, Load Life Stability of 0.05% ,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +225 | 100 | 5K |
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| Ultra High Precision Foil Wraparound Surface Mount Chip Resistor with Extended Pads for High Power/High Temperature Applications up to +225 °C, Load Life Stability of 0.05% ,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +225 | 10 | 8K |
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| Ultra High-Precision Foil Wraparound Surface Mount Chip Resistor for High Temperature Applications up to +200°C, Humidity Proof (85°C/85% RH) to 0.005%, Stability Under Load of 0.02% | Surface Mount | 0.01 | 2.5 | +200 | 5 | 125K |
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| Ultra High-Precision Foil Wraparound Surface Mount Chip Resistor for High Temperature Applications up to +200°C, Humidity Proof (85°C/85% RH) to 0.005%, Stability Under Load of 0.02% | Surface Mount | 0.01 | 2.5 | +200 | 100 | 4K |
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| Ultra High-Precision Foil Wraparound Surface Mount Chip Resistor for High Temperature Applications up to +200°C, Humidity Proof (85°C/85% RH) to 0.005%, Stability Under Load of 0.02% | Surface Mount | 0.01 | 2.5 | +200 | 5 | 8K |
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| Ultra High-Precision Foil Wraparound Surface Mount Chip Resistor for High Temperature Applications up to +200°C, Humidity Proof (85°C/85% RH) to 0.005%, Stability Under Load of 0.02% | Surface Mount | 0.01 | 2.5 | +200 | 5 | 25K |
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| Ultra High-Precision Foil Wraparound Surface Mount Chip Resistor for High Temperature Applications up to +200°C, Humidity Proof (85°C/85% RH) to 0.005%, Stability Under Load of 0.02% | Surface Mount | 0.01 | 2.5 | +200 | 5 | 30K |
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| Ultra High-Precision Foil Wraparound Surface Mount Chip Resistor for High Temperature Applications up to +200°C, Humidity Proof (85°C/85% RH) to 0.005%, Stability Under Load of 0.02% | Surface Mount | 0.01 | 2.5 | +200 | 5 | 70K |
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| Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip
Resistor for Hybrid Circuits for High Temperature Applications
up to +240 °C, Long Term Stability of 0.05%,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +240 | 5 | 125K |
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| Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip
Resistor for Hybrid Circuits for High Temperature Applications
up to +240 °C, Long Term Stability of 0.05%,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +240 | 100 | 5K |
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| Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip
Resistor for Hybrid Circuits for High Temperature Applications
up to +240 °C, Long Term Stability of 0.05%,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +240 | 5 | 8K |
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| Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip
Resistor for Hybrid Circuits for High Temperature Applications
up to +240 °C, Long Term Stability of 0.05%,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +240 | 5 | 25K |
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| Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip
Resistor for Hybrid Circuits for High Temperature Applications
up to +240 °C, Long Term Stability of 0.05%,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +240 | 5 | 30K |
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| Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip
Resistor for Hybrid Circuits for High Temperature Applications
up to +240 °C, Long Term Stability of 0.05%,TCR to ± 1ppm/ °C | Surface Mount | 0.02 | 2.5 | +240 | 5 | 70K |
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| Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240 °C, Long Term Stability of 0.05% | Surface Mount | 0.02 | 2.5 | +240 | 5 | 125K |
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| Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240 °C, Long Term Stability of 0.05% | Surface Mount | 0.02 | 2.5 | +240 | 5 | 10K |
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| Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240 °C, Long Term Stability of 0.05% | Surface Mount | 0.02 | 2.5 | +240 | 5 | 30K |
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| Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240 °C, Long Term Stability of 0.05% | Surface Mount | 0.02 | 2.5 | +240 | 30K | 80K |
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| Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240 °C, Long Term Stability of 0.05% | Surface Mount | 0.02 | 2.5 | +240 | 100 | 5K |
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| Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240 °C, Long Term Stability of 0.05% | Surface Mount | 0.02 | 2.5 | +240 | 5 | 8K |
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| Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240 °C, Long Term Stability of 0.05% | Surface Mount | 0.02 | 2.5 | +240 | 5 | 25K |
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| Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240 °C, Long Term Stability of 0.05% | Surface Mount | 0.02 | 2.5 | +240 | 5 | 70K |
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| Custom Hermetically Sealed Precision Resistor Network Devices For High Temperature
(PRND) With Screen/Test Flow in Compliance with EEE-INST-002
(Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-83401 | Through Hole | 0.01 | 2.5 | +230 | 5 | 125K |
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| High Precision Foil Resistor with TCR of ±1.5 ppm/°C, Tolerance of ±0.005% and Load Life Stability of ±0.05% | Through Hole | 0.005 | | +175 | 1 | 200K |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 2.0 | +175 | 0.5 | 1M |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 2.0 | +175 | 1 | 150K |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 2.0 | +175 | 1 | 500K |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 2.0 | +175 | 1 | 750K |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 2.0 | +175 | 0.5 | 1M |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 1.0 | +175 | 1 | 100K |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 1.0 | +175 | 1 | 300K |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 1.0 | +175 | 1 | 500K |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 1.0 | +175 | 0.5 | 600K |
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| S Series - High Performance Aerospace and Instrumentation Resistors | Through Hole | 0.005 | 1.0 | | 0.5 | 600K |
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| Precision Molded Surface Mount Resistor | Surface Mount | 0.01 | 2.0 | +175 | 5 | 80K |
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| Precision Molded Surface Mount Resistor | Surface Mount | 0.01 | 2.0 | +175 | 5 | 33K |
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| Ultra High Precision Z-Foil Resistor with TCR of ± 0.05 ppm/ °C | Through Hole | 0.005 | 0.0050 | +175 | 5 | 600K |
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| Ultra High Precision Z-Foil Resistor with TCR of ± 0.05 ppm/ °C | Through Hole | 0.005 | 0.05 | +175 | 5 | 100K |
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| Ultra High Precision Z-Foil Resistor with TCR of ± 0.05 ppm/ °C | Through Hole | 0.005 | 0.05 | +175 | 5 | 200K |
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| Ultra High Precision Z-Foil Resistor with TCR of ± 0.05 ppm/ °C | Through Hole | 0.005 | 0.05 | +175 | 5 | 300K |
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| Ultra High Precision Z-Foil Resistor with TCR of ± 0.05 ppm/ °C | Through Hole | 0.005 | 0.05 | +175 | 5 | 600K |
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| Ultra High-Precision Through-Hole Foil Resistor for High Temperature Applications up to +200�C | Through Hole | 0.01 | 0.2 | | 10 | 100K |
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| Ultra High Precision Z1-Foil resistor for Metrology and Laboratory Applications | Through Hole | 0.005 | 0.5 | +175 | 10 | 100K |