|
|
|
 | Networks | Resistor Networks | PRND Networks Qualified to MIL-PRF 83401 Characteristic "c" Schematic A | Through Hole | 0.1 | 5.0 | 100 | 10K |
|
|
|
 | Networks | Resistor Networks | Ceramic Dual In Line Package | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Ceramic Dual In Line Package | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Ceramic Dual In Line Package | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Custom Hermetically Sealed Precision Resistor Network Devices
(PRND) With Screen/Test Flow in Compliance with EEE-INST-002
(Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-83401 | Through Hole | 0.005 | 2.0 | 5 | 60K |
|
|
|
 | Networks | Resistor Networks | Custom Hermetically Sealed Precision Resistor Network Devices For High Temperature
(PRND) With Screen/Test Flow in Compliance with EEE-INST-002
(Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-83401 | Through Hole | 0.01 | 2.5 | 5 | 125K |
|
|
|
 | Networks | Resistor Networks | Glass to Metal Seal Headers | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Glass to Metal Seal Headers | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Glass to Metal Seal Headers | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Glass to Metal Seal Headers | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Glass to Metal Seal Headers | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Glass to Metal Seal Headers | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Networks | Resistor Networks | Glass to Metal Seal Headers | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
| | Networks | Resistor Networks | Glass to Metal Seal Headers | Through Hole | 0.005 | 2.0 | 5 | 80K |
|
|
|
 | Resistors | Resistors, Fixed | Hybrid Chips (Gold Plated Pads) | Surface Mount | 0.005 | 5.0 | 5 | 80K |
|
|
|
| Resistors | Resistors, Fixed | Hybrid Chips (Gold Plated Pads) | Surface Mount | 0.005 | 5.0 | 5 | 10K |
|
|
|
| Resistors | Resistors, Fixed | Hybrid Chips (Gold Plated Pads) | Surface Mount | 0.005 | 5.0 | 5 | 33K |
|
|
|
| Resistors | Resistors, Fixed | Hybrid Chips (Gold Plated Pads) | Surface Mount | 0.005 | 5.0 | 33K | 80K |
|
|
|
 | Resistors | Resistors, Fixed | Z Foil Hybrid Chips (Gold Plated Pads) | Surface Mount | 0.01 | 2.0 | 50 | 30K |
|
|
|
| Resistors | Resistors, Fixed | Z Foil Hybrid Chips (Gold Plated Pads) | Surface Mount | 0.01 | 2.0 | 50 | 5K |
|
|
|
 | Networks | Resistor Networks | Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks in Gull Wing Configuration | Surface Mount | 0.005 | 2.0 | 5.0 | 80K |
|
|
|
 | Networks | Resistor Networks | Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration | Surface Mount | 0.005 | 2.0 | 5.0 | 80K |
